Wafer Inspection System is a PC-based inspection system equipped with a motion control system to check the top and bottom of the wafer surface for rejected die portion. It is installed with two CCD cameras that are mounted on the top and the bottom shelf. The wafer sits on a 2-axis motion-controlled fixture, which will index the wafer over a whole-predefined inspection area. It uses pneumatic actuator to align the wafer and to position the inking head to mark the rejected cavities.